PVD is known as Physical Vapor Deposition. In the vacuum chamber, PVD process takes place in a temperature range of about 200°C to 450°C. The solid coating material with high purity, e.g. chromium, aluminium or titanium, is either evaporated by heat or ion bombardment (sputtering).
At the same time, addition of reactive gas, e.g. nitrogen or gas containing carbon, will form a coating layer which is of high hardness and adhesion on the substrates. E.g. TiN (Titanium Nitride), TiCN (Titanium Carbonitride), TiAlN (Titanium Aluminium Nitride) and CrN (Chromium Nitride).
